二手松下貼片機MSR程序的構成
MACHINE OFFSET值應放在MACHINE DATA內，但往往MACHINE DATA內并未設置。
程序補償值因單臺設備而多少有些差異，設置補償值后，實際貼裝一個元件，直到修正無誤為止。
**** NO.2
注:如果**句被SKIP掉,機器會執行”PASS-THROUGH”
13．MT.HGH
程序的構成：
1． PCB：OGR----SUPPORT PIN REMOVAL---PCB PROGRAM CREATION---自動調寬---REFERENCE PIN 調整（OPTION）---STOPPER ADJUSTMENT—SUPPORT PININSTALLATION—PCB TRANSFER
2． MARK LIBRARY
3． NC PROGRAM
4． PARTS LIBRARY
5． ARRAY PROGRAM
6． PROGRAM SELECTION
一． PCB PROGRAM的理解
二． MARK LIBRARY的理解
1．PCB MATERIAL CODE
|
CODE
|
PCB MATERIAL
|
MARK MATERIAL
|
|
|
0
|
PAPER PHENOL
（基板是樹脂）
|
COPPER FOIL
銅箔
|
|
|
1
|
PAPER PHENOL
（基板是樹脂）
|
SOLDER METAL PLATING（錫箔）
|
|
|
4
|
CERAMIC
（基板是陶瓷）
|
SILVER PALLADIUM PASTE（銀箔）
|
|
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5
|
CERAMIC
（基板是陶瓷）
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銅箔
|
|
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6
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CERAMIC
（基板是陶瓷）
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GOLD PADTE（金箔）
|
|
2．REC TYPE
|
|
|
|
|
0
|
GRAY SCAL MARK（輝度）
|
|
|
1
|
BINARY MARK（二值）用在氧化板上
|
|
|
2
|
DISTINCTION MARK（特殊MARK，一般不用，BAD MARK識別，用于拼版，其中一塊損傷情形）
|
|
2—DISTINCTION MARK
DISTINCTION MARK必須比框大，一般2MM*2MM以上
正負10百分—NORMAL；20百分—ROUGH；30百分—VERY ROUGH。
2．LIGHT：
|
|
MSR
|
MV2VB
|
|
1
|
SPREAD環射
|
RING
|
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2
|
DIRECT弱射
|
SPOT
|
|
3
|
DIRECT+SPREAD環+弱
|
RING+SPOT
|
|
LED |
|
SPREAD
|
|
DIRECT
|
（三）、NC PROGRAM 的理解
*確定元件安裝順序時，應注意以下幾點
1．按元件尺寸由小到大地貼裝。
2．為使Z軸移動較少，同一元件的尺寸應集中貼裝。
3．盡量使X-Y TABLE少移動。
*程序指令優先順序：
1．執行（SR）語句
2．BAD MARK語句壞板標記檢出指令
3．MARK 語句
4．貼裝語句
N C: ARRAY: PCB:
OFFSET X: Y: HM: MULTI ORG. BLOCKS: MARK LAND:
|
BLOCK
NO.
|
X
|
Y
|
Z NO.
|
S&R
|
THETA
θ
|
SKIP
|
MT.HGHT
|
MRK
|
NO
|
MT.WAIT
|
GROUP
|
PROD
|
CMNT
|
|
1
|
0
|
0
|
1
|
02
|
0
|
0
|
0
|
0
|
0
|
0
|
|
0
|
|
|
2
|
-124.2
|
37.5
|
1
|
22
|
0
|
0
|
0
|
0
|
0
|
0
|
|
0
|
|
|
3
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
4
|
|
|
|
|
|
|
|
|
|
|
|
|
|
1．NC、ARRAY、PCB
2．OFFSET：X ： Y：
INPUT THE DIFFERENCE（DISTANCE）BETWEEN THE ORIGINAL POSITION OF THE PANASERT AND POSITIONS OF THE X AND Y COORDINATES ON THE PC BOARD。
指線路板上的坐標原點與機器固有的機械原點之間的距離補償。
機械原點是固定值，坐標原點因每個程序而異，可自由設定。
設置坐標原點后，設置程序補償值。
*機器的原點到程序原點（機器貼裝頭）的距離。
MACHINE OFFSET值應放在MACHINE DATA內，但往往MACHINE DATA內并未設置。
|
XY |
|
YY
|
程序補償值因單臺設備而多少有些差異，設置補償值后，實際貼裝一個元件，直到修正無誤為止。
一般設置程序補償值以**個貼裝點為準或MARK點為準。
*背離電機：負
接近電機：正
*CAD數據+MACHINE OFFSET=生產坐標
3．HM（X-Y T）：貼裝時等待高度。（前道工序已安裝元件的*高高度，設置該值，防止碰到
已安裝元件。
4．MULTI ORG：多重原點
MLTI ORG F=
默認值是1
例:MULTI-ORIGIN=40
**** NO.2
|
1
|
2
|
..
|
|
|
|
|
39
|
40
|
41
|
42
|
...
|
|
|
75
|
因可根據不同程序指定，所以若將數種元件配置事先裝好后只需變更多重原點的指定，便可更換生產的品種。
5．BLOCKS：
6．MARK LAND：共有多少MARK（5、6機器會顯示，不可修改）
7．BLOCK：編號
8．X、Y：貼裝點的坐標
X：右為正，左為負；
Y：里側為正，外側為負。
9．Z NO。：用哪一料站
|
|
標準送料器（SINGLE）
|
DOUBLE
|
|
K型
|
21．5MM
|
10．75MM
|
|
Q型
|
20．00MM
|
10．00MM
|
10.S&R:用兩列代碼指定連片逐點或連片逐片方式及貼裝圖案的旋轉角度。
|
|
0
|
1(STEP REPEAT)
|
2(PATTERN REPEAT)
|
|
0(0度)
|
NORMAL MOUNTING
NO ROTATION
|
|
|
|
1(90度)
|
|
STEP REPEAT
90度ROTATION
|
PATTERN REPEAT
90度ROTATION
|
|
2(180度)
|
|
STEP REPEAT
180度ROTATION
|
PATTERN REPEAT
180度ROTATION
|
|
3(270度)
|
|
STEP REPEAT
270度ROTATION
|
PATTERN REPEAT
270度ROTATION
|
01—O度STEP REPEAT
11—90度STEP REPEAT
21—180度STEP REPEAT
31—270度STEP REPEAT
02—0度PATTERN REPEAT
12—90度PATTERN REPEAT
22—180度PATTERN REPEAT
32—270度PATTERN REPEAT
注：S&R的**個圖案的補償值（X、Y坐標）必須輸入（0，0）
若語句1S&R寫22,貼裝出錯.
11．SKIP: 1)0:BLOCK IS EXECUTED
2)7:BLOCK IS NOT EXECUTED(無條件跳躍)
3)1-6,8,9有條件跳躍
|
270 |
注:如果**句被SKIP掉,機器會執行”PASS-THROUGH”
12.THETA:貼裝角度：元件在PCB板上貼時的角度。
|
180 |
13．MT.HGH
T:貼裝高度補償(X-Y T補償)
14.MRK:
|
MARK
|
FIDUCIAL
|
0:NO MARK
|
|
|
1:INDIVIDUAL MARK
|
|||
|
2:BOARD MARK
|
|||
|
3:PATTERN MARK(拼版)
|
|||
|
4:GROUP MARK
|
|||
|
DISTINCT MARK
|
DISTINCT MARK(SENSOR)
|
10:BAD MARK
|
|
|
13:VARIETY SELECT MARK
|
|||
|
DISTINCT MARK(CAMERA)
|
20:BAD MARK
|
||
|
23:VARIETY SELECT MARK
|
|||
15.NO:禁止貼裝判斷 0:進行貼裝 1:禁止貼裝
16.MT.WAIT:貼裝等待0:正常貼裝
1:貼裝等待(一般是較高的元件,防止碰撞而放在*后貼裝)
17.GROUP(單獨使用):
18.PROD:(異種—針對混合類型,二者配合使用)
19.CMNT:注釋
EXAMPLE：普通陰陽板
|
BLOCK
NO.
|
X
|
Y
|
Z NO.
|
S&R
|
THETA
θ
|
SKIP
|
MT.HGHT
|
MRK
|
NO
|
MT.WAIT
|
GROUP
|
PROD
|
CMNT
|
|
1
|
0
|
0
|
1
|
02
|
0
|
0
|
0
|
0
|
0
|
0
|
0
|
0
|
|
|
2
|
88.4
|
0
|
1
|
02
|
0
|
0
|
0
|
0
|
0
|
0
|
0
|
0
|
|
|
3
|
0
|
0
|
1
|
0
|
0
|
0
|
0
|
23
|
0
|
0
|
0
|
1
|
|
|
4
|
0
|
0
|
1
|
0
|
0
|
0
|
0
|
23
|
0
|
0
|
0
|
2
|
|
|
5
|
0
|
0
|
1
|
0
|
0
|
0
|
0
|
4
|
0
|
0
|
1
|
0
|
|
|
6
|
0
|
0
|
1
|
0
|
0
|
0
|
0
|
4
|
0
|
0
|
2
|
0
|
|
|
7
|
43.35
|
77.36
|
1
|
0
|
0
|
0
|
0
|
0
|
0
|
0
|
1
|
1
|
R1
|
|
8
|
48.38
|
74.77
|
2
|
0
|
90
|
0
|
0
|
0
|
0
|
0
|
1
|
1
|
C1
|
|
9
|
96.5
|
69.80
|
3
|
0
|
0
|
0
|
0
|
0
|
0
|
0
|
2
|
2
|
Q1
|
|
10
|
99.21
|
69.80
|
4
|
0
|
270
|
0
|
0
|
0
|
0
|
0
|
2
|
2
|
Q2
|
|
METHORD
|
CLASSIFICATIONG
|
TYPE
|
APPLICABLE PART
|
|
TRANSMISSIVE（BINARY）透射
|
1
|
0
|
Square chip(standard)
|
|
2
|
0
|
Small transistor(standard)
|
|
|
2
|
1
|
Small transistor(part with marry burrs on the body)
|
|
|
3
|
0
|
Thin component(standard)
|
|
|
3
|
1
|
Thin component(part that looks as if it has a hole)
|
|
|
4
|
0
|
QFP,SOP(standard)
|
|
|
6
|
0
|
Large transisitor(standard)
|
|
|
7
|
0
|
Odd-shaped component(standard)
|
|
|
8
|
0
|
HEMT(standard)
|
|
|
9
|
0
|
Round component(standard)
|
|
|
11
|
0
|
Aluminum electrolytic capacitor(standard)
|
|
|
Reflective (Gray scale) 反射
|
13
|
0
|
Air wound coil
|
|
20
|
0
|
Square chip resistor(strong against noise)
|
|
|
20
|
1
|
Square chip resistor
|
|
|
20
|
3
|
Square chip resistor(with upside down check)
|
|
|
21
|
0
|
Cylindrical chip resistor(standard)
|
|
|
21
|
1
|
Cylindrical chip resistor(when reflection is unstable)
|
|
|
22
|
0
|
Chip resistor network(with pickup check)
|
|
|
22
|
1
|
Chip resistor network(without pickup check)
|
|
|
30
|
0
|
Square chip capacitor(when nozzle glitters)
|
|
|
30
|
1
|
Square chip capacitor(standard)
|
|
|
31
|
0
|
Tantalum electrolytic capacitor(black)
|
|
|
31
|
1
|
Tantalum electrolytic capacitor(white)
|
|
|
32
|
0
|
Tantalum electrolytic capacitor(black)
|
|
|
40
|
0
|
Transistor(standard)
|
|
|
40
|
1
|
Transistor(with wide lead)
|
|
|
40
|
5
|
Transistor(with electrode which appears to be dark)
|
|
|
41
|
0
|
Mini power transistor(standard)
|
|
|
42
|
0
|
Large power transistor(standard)
|
|
|
43
|
0
|
Two-terminal diode(standard)
|
|
|
44
|
0
|
Light emitting diode
|
|
|
44
|
1
|
Light emitting diode(standing pickup check at both edge electrodes)
|
|
|
44
|
2
|
Light emitting diode(standing pickup check at the body center)
|
|
|
48
|
0
|
SOP
|
|
|
50
|
0
|
Unidirectional lead connector
|
|
|
51
|
0
|
2-directional lead connector
|
|
|
Reflective (Gray scale) 反射
|
52
|
0
|
SOP
|
|
53
|
0
|
QFP
|
|
|
54
|
0
|
SOJ
|
|
|
55
|
0
|
PLCC
|
|
|
56
|
0
|
Black BGA/CSP
|
|
|
57
|
0
|
LCC
|
|
|
72
|
0
|
Chip SAW filter(inclination determined by four sides)
|
|
|
72
|
1
|
Chip SAW filter(inclination determined by top/bottom sides)
|
|
|
72
|
2
|
Chip SAW filter(inclination determined by left/right sides)
|
|
|
86
|
0
|
Checker chip
|
|
|
90
|
0
|
White connector
|
|
|
90
|
3
|
Shield case
|
公安機關備案號：
