千住水溶性錫膏 M705-515A(8)C1-T8G
產(chǎn)品簡介
錫96.5、銀3.0、銅0.5###熔點(diǎn):217-220℃###粘度:180-220Pa.s###230-260℃###要求無松香殘留的工藝,純水能輕松清洗殘留物###0-10℃
產(chǎn)品詳細(xì)信息
千住水溶性錫膏 M705-515A(8)C1-T8G(無鹵素錫膏)及M705-WSG15為千住金屬開發(fā)之水洗性錫膏.
1.Scope
This specification covers the solder paste,
ECO SOLDER PASTE M705-515A(8)C1-T8G, using lead-free solder alloy, used
for wiring connection and so on, of electrical and electronic parts.
2.Standard
2.1 Chemical composition of solder alloy(Test method : STM-9-1)
Composition and impurities are prescribed as following tables.
Composition ( mass% )
Ag3.0 ± 0.1 /Cu0.50 ± 0.05/Sn
2.2 Melting temperature range and specific gravity of solder alloy(Reference value)
Melting temperature range ℃
Approx. 217 ~ 220
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